To solve these thermal obstacles and build "future proof" thermally correct high-density high performance 1U and 2U solutions, CCSI created a task force of engineering experts with one objective: to design and develop both 1U and 2U server solutions that meet and exceed the thermal requirements of not only today's but also future high performance CPU's.

Our Goals were:

A) To invent a new exhaust system which allows the maximum cross flow possible in these high-density server chassis. Mission Accomplished

B) To invent a new "outside the box" CPU cooling system that draws air from outside the chassis rather than recirculating warm air from within the chassis. This design incorporates adequate volume, velocity and pressure of air to not only cool the CPU's but also the other hot components on the motherboard as well as peripheral cards. Mission Accomplished

C) To invent a new generation of high power low profile 1U power supply to meet the power budget of current and future high performance CPU's. Mission Accomplished

D) To invent an all new server component layout for optimum configuration, fault tolerance and serviceability. Mission Accomplished

It took our team over 2000 man-hours to complete these tasks and finally gain the recommendation of our most stringent partner, AMD, for all their present and planned future speed grades of the Athlon MP processors.